High efficiency converters help maximize run-time for autonomous warehouse robots
High efficiency converters help maximize run-time
PRM™ Regulator and VTM™ Current Multiplier
Factorized power solutions
PRM & VTM solutions leverage the advantages of Factorized Power Architecture™ for high power, low voltage, isolated and non-isolated point of load applications. Factorized Power Architecture™ uses PRMs (Pre Regulation Modules) or buck-boost regulators and VTMs (Voltage Transformation Modules) or current multipliers at the point of load, to provide a complete DC-DC solution.
PRM™ Regulator Modules
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| Part Number | Datasheet | Vin (V) | Vout (V) | Power (W) | Output Current (A) | Temperature | VTM Compatibility | Dimensions mm | Dimensions in. | Features | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 200 |
Output Current (A): 4.17 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 200 |
Output Current (A): 4.17 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (36 - 75) |
Vout (V): 48 (20 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (38 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 600 |
Output Current (A): 12.50 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (38 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 600 |
Output Current (A): 12.50 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 200 |
Output Current (A): 4.17 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Remote Sense |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (38 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 250 |
Output Current (A): 5.21 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 200 |
Output Current (A): 4.17 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Remote Sense |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (38 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 250 |
Output Current (A): 5.21 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 600 |
Output Current (A): 12.50 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 400 |
Output Current (A): 8.33 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (38 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 45 (38 - 55) |
Vout (V): 48 (5 - 55) |
Power (W): 600 |
Output Current (A): 12.50 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Remote Sense |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 250 |
Output Current (A): 5.21 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 250 |
Output Current (A): 5.21 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 53 (20 - 55) |
Power (W): 250 |
Output Current (A): 4.72 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.87 x 0.650 x 0.265in |
Features: Configurable |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -55 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (45 - 55) |
Vout (V): 48 (20 - 55) |
Power (W): 500 |
Output Current (A): 10.42 |
Temperature: -40 to +125°C |
VTM Compatibility: Yes |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Features: Configurable |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 54 (38 - 60) |
Vout (V): 48 (30 - 54) |
Power (W): 800 |
Output Current (A): 16.60 |
Temperature: -40 to +125°C |
VTM Compatibility: No |
Dimensions mm: 22.8 x 13.8 x 7.41mm |
Dimensions in.: 0.89 x 0.544 x 0.292in |
Features: None |
Package: 2313 SM Chip |
View Details | ||
VTM™ Current Multiplier Modules
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | K Factor | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Vin (V): 40 (26 - 55) |
Vout (V): 1.0 (0.7 - 1.4) |
Output Current (A): 130.0 |
K Factor: 1/40 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 46.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.4 |
K Factor: 2/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.3 |
K Factor: 1 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 42 (26 - 55) |
Vout (V): 3.5 (2.2 - 4.6) |
Output Current (A): 25.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.2 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.5 |
K Factor: 2/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.25 |
K Factor: 1 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 40 (0 - 60) |
Vout (V): 5.0 (0 - 7.5) |
Output Current (A): 25.0 |
K Factor: 1/8 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
| Part Number: | Vin (V): 48 (0 - 60) |
Vout (V): 12.0 (0 - 15) |
Output Current (A): 12.5 |
K Factor: 1/4 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
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Maximum output:
Features and Benefits
Features and benefits
High density
Wide VIN optimized for 48VOUT
High efficiency
Flexible
Resources
Resources for the design engineer
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Modular DC-DC system design done right
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FPA™ (Factorized Power Architecture™) has provided leverage in solving demanding power challenges which call for high levels of efficiency, power density and superior power handlin...
- AN:005 FPA Printed Circuit Board Layout Guidelines
- AN:009 SMT J-Lead VI Chip Soldering Recommendations (For surface mount full and half VI Chip packages)
- AN:017 SMT RoHS-Compliant Through-Hole VI Chip Soldering Recommendations(For through-hole full VI Chip packages)
- AN:022 MIL EMI and Transient Solutions
- AN:031 Through-Hole ChiP Package Soldering Guidelines(For through hole ChiP (Converter Housed in a Packages), example packages: 6123, 2361, 4623, and 2223)
- AN:034 Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:701 SM-ChiP™ Reflow Soldering Recommendations
- FPA Overview: An Introduction to FPA
- Enabling Next Generation High-Density Power Conversion
- High Current, Low Voltage Solution for Microprocessor Applications from 48 V Input
- Datacenter Power Delivery Architectures: Efficency and Annual Operating Costs
- Efficient Power Conversion Solutions
- Dual-Stage Feedback Technique for Single-Pole Feedback Compensation
- A fanless power solution gives antenna array fast, reliable data coverage
- Remote radio units better distribute traffic while operating under fault conditions
- Pulsed energy demands of airborne infrared countermeasures are averaged out to avoid system interference
- Automated test equipment’s speed and throughput improves with factorized power architecture
- Separating the functions of a traditional DC converter improves the speed and accuracy for 3D printers
- Industrial welding laser speed and accuracy improves using factorized power architecture
Full-Chip PRM
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
For California residents see information regarding California Proposition 65
- J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - PRM Flanged VI Brick Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - VTM Flanged VI Brick Outline Drawing
PDF DXF
- PRM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - PRM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - PRM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP - 2308 SM-ChiP Product 3-D Model Drawing
IGS STP - VTM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - VTM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP
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