Modular DC-DC system design done right
Factorized power solutions
Factorized power solutions
PRM & VTM solutions leverage the advantages of Factorized Power Architecture™ for high power, low voltage, isolated and non-isolated point of load applications. Factorized Power Architecture™ uses PRMs (Pre Regulation Modules) or buck-boost regulators and VTMs (Voltage Transformation Modules) or current multipliers at the point of load, to provide a complete DC-DC solution.
Features and Benefits
Features and benefits
High density
Wide VIN optimized for 48VOUT
High efficiency
Flexible
Select a PRM
0 Products
| Vin (V) | Vout (V) | Output Power (W) | Package | Note | Add to cart / view details | ||
|---|---|---|---|---|---|---|---|
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Vin (V): 48 (38-55) | Vout (V): 48 (5.0-55) | Output Power (W): 200 | Package: Half Chip | Note: 2, 3 | View details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 250 | Package: Half Chip | Note: | View details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (5.0-55) | Output Power (W): 400 | Package: Full Chip | Note: 2, 3 | View details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 500 | Package: Full Chip | Note: | View details | |
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Vin (V): 48 (36-75) | Vout (V): 48 (20-55) | Output Power (W): 200 | Package: Half Chip | Note: | View details | |
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Vin (V): 48 (36-75) | Vout (V): 48 (20-55) | Output Power (W): 400 | Package: Full Chip | Note: | View details | |
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Vin (V): 48 (45-55) | Vout (V): 48 (20-55) | Output Power (W): 500 | Package: Full Chip | Note: 1 | View details | |
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Vin (V): 48 (45-55) | Vout (V): 48 (20-55) | Output Power (W): 250 | Package: Half Chip | Note: 1 | View details | |
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Vin (V): 53 (45-55) | Vout (V): 53 (20-55) | Output Power (W): 250 | Package: Half Chip | Note: 1, 2 | View details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (5.0-55) | Output Power (W): 600 | Package: Full Chip | Note: 2, 3 | View details | |
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Vin (V): 48 (38-60) | Vout (V): 48 (30-54) | Output Power (W): 800 | Package: 2313 SM-ChiP | Note: | View details | |
Notes:
1. PFM Compatible, PRM is designed to follow PFM AC/DC products, see datasheet for details.
2. High Capacitance Load capable. PRM is designed to drive high capacitance loads, see datasheet for details.
3. External Error Amp required. PRM designed for Remote Sense Operation, see datasheet for detail
Select a VTM
0 Products
| Vin (V) | Vout (V) | Output Current (A) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.17 - 4.58) | Output Current (A): 50 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 6.0 (3.25 - 6.87) | Output Current (A): 40 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 8.0 (4.34 - 9.16) | Output Current (A): 30 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 9.6 (6.4 - 11.0) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 16 (8.67 - 18.3) | Output Current (A): 15 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 24 (13.8 - 26.5) | Output Current (A): 12 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 32 (17.3 - 36.7) | Output Current (A): 9 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 48 (26 - 55) | Output Current (A): 6 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 10 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.17 - 4.58) | Output Current (A): 25 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.2 - 4.6) | Output Current (A): 50 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (0 - 60) | Vout (V): 12 (0 - 15) | Output Current (A): 12.5 | Package: 2308 SM-Chip | View details | |
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Vin (V): 48 (0 - 60) | Vout (V): 6 (0 - 7.5) | Output Current (A): 25 | Package: 2308 SM-Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 6.0 (2.85 - 6.88) | Output Current (A): 20 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 1.2 (0.7-1.4) | Output Current (A): 130 | Package: Full Chip | View details | |
Power System Designer
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Output
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Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Power/Current:
Resources
Resources for the design engineer
- AN:005 FPA Printed Circuit Board Layout Guidelines
- AN:009 SMT J-Lead VI Chip Soldering Recommendations (For surface mount full and half VI Chip packages)
- AN:017 SMT RoHS-Compliant Through-Hole VI Chip Soldering Recommendations(For through-hole full VI Chip packages)
- AN:022 MIL EMI and Transient Solutions
- AN:031 Through-Hole ChiP Package Soldering Guidelines(For through hole ChiP (Converter Housed in a Packages), example packages: 6123, 2361, 4623, and 2223)
- AN:032 Designing High Power Parallel Arrays with PRMs
- AN:033 Fault Management Circuit
- AN:034 Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:701 SM-ChiP™ Reflow Soldering Recommendations
- FPA Overview: An Introduction to FPA
- Enabling Next Generation High-Density Power Conversion
- High Current, Low Voltage Solution for Microprocessor Applications from 48 V Input
- Datacenter Power Delivery Architectures: Efficency and Annual Operating Costs
- Efficient Power Conversion Solutions
- Dual-Stage Feedback Technique for Single-Pole Feedback Compensation
- A fanless power solution gives antenna array fast, reliable data coverage
- Remote radio units better distribute traffic while operating under fault conditions
- Pulsed energy demands of airborne infrared countermeasures are averaged out to avoid system interference
- Automated test equipment’s speed and throughput improves with factorized power architecture
- Separating the functions of a traditional DC converter improves the speed and accuracy for 3D printers
- Industrial welding laser speed and accuracy improves using factorized power architecture
Full-Chip PRM
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
For California residents see information regarding California Proposition 65
- J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - PRM Flanged VI Brick Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - Through-Hole Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - J-lead Product Outline Drawing
PDF DXF - VTM Flanged VI Brick Outline Drawing
PDF DXF
- PRM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - PRM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - PRM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP - 2308 SM-ChiP Product 3-D Model Drawing
IGS STP - VTM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - VTM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP
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Get more documents, videos and case studies in the resource library for engineers
Related Products
Related Products
Pre- and post-transformation regulators
Factorized power current multiplier
Rugged factorized power solutions