
Rob Russell shares his industry insights into the future of LEO and MEO satellite deployments
A satellite constellation with advanced communications technology has comparable latency to fiber and is capable of transporting multiple gigabits of network traffic to virtually any location. Bandwidth-intensive applications and the number of smart connected devices are rapidly increasing, requiring high-performance connectivity for businesses, ships, airplanes, autonomous vehicles and broadband internet users, anytime and anywhere around the world.
New LEO and MEO satellites are equipped with breakthrough digital payload electronics and require high-density, high-efficiency, low-noise power delivery networks (PDNs), particularly for their advanced networking ASICs. These power delivery solutions must also be tolerant to both TID (total ionizing dose) radiation and SEE (single event effects).
Vicor radiation-tolerant power modules enable the ideal Power Delivery Network (PDN) for today’s LEO and MEO satellites, providing high efficiency, high density, low-noise voltage conversion to power advanced network communication ASICs and processors.
Power delivery performance and reliability are ensured by using proven topologies and Vicor standard CM-ChiPTM module construction on fully automated high volume lines in Andover, Massachusetts. Both TID and SEE radiation tolerance are ensured by careful component selection, qualification testing, and lot testing. Additionally, a dual power train fault-tolerant topology eliminates single event functional interrupts (SEFI).
Providing complete source to point-of-load radiation-tolerant COTS solutions allow developers to reduce time to market and cost while maximizing board space utilization. Vicor power modules enable innovation in aerospace, defense, and supercomputing applications powering advanced communication arrays and the most advanced processors used for AI today.
Single event functional interrupt (SEFI) immunity is achieved using a redundant architecture, where two identical and parallel powertrains with fault-tolerant control ICs are housed in a single, high-density SM-ChiP package.
Factorized modular power architecture
Low noise
High efficiency
High power and current density
Factorized Power Architecture (FPA) factorizes power from the traditional single-function DC-DC converter into two distinct functions and power modules: a pre-regulation module, a PRM and a voltage transformation module, a VTM. The power switching topologies and control systems of each module are optimized for low noise and power losses, with zero-current and zero-voltage switching. The PRM and VTM components have high density, high efficiency, low noise operation and factorization allows the VTM to be placed close to the load minimizing board losses in high current applications.
BCM3423 bus converter module
Input: 100V (94 – 105V, 120V transient)
Output: 33V (31 – 35V)
Power: 300W
Bus converter ratio: K = 1/3
Typical full load efficiency: 94%
33.5 x 23.1 x 8.0mm
25.9g
PRM2919 regulator module
Input: 33V (30 – 36V)
Output: 32V (13.4 – 35V)
Power: 200W
Current: IOUT 8A max
Typical full load efficiency: 96%
29.2 x 19.0 x 8.0mm
18.2g
VTM2919 0.8V, 150A voltage transformation module
Input: 13.4 – 35V
Output: 0.42 – 1.1V
Power: 150A
Converter ratio: K = 1/32
Typical full load efficiency: 89%
29.2 x 19.0 x 5.5mm
13.3g
VTM2919 3.3V, 50A voltage transformation module
Input: 16 – 32V
Output: 2 – 3.8V
Power: 50A
Converter ratio: K = 1/8
Typical full load efficiency: 91%
29.2 x 19.0 x 5.5mm
11g
Rob Russell shares his industry insights into the future of LEO and MEO satellite deployments
Global connectivity becoming a reality with the help of new, high density, power solutions
Space and satellite frequently asked questions (FAQs)
Delivering higher power density and low noise for New Space applications