Reliability Data
Mean Time Between Failure (MTBF)
Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user's system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate.
Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.
MTBF in 1000 Hours |
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Part Number | Baseplate Temperature | G.B. | G.F. | A.I.C. | N.S. |
MI-J71-MY | 25°C | 3,782 | 1,891 | 1,135 | 1,116 |
50°C | 2,307 | 1,154 | 692 | 681 | |
65°C | 1,778 | 889 | 533 | 524 | |
MI-274-MW | 25°C | 3,830 | 1,878 | 1,149 | 1,130 |
50°C | 2,336 | 1,915 | 701 | 689 | |
65°C | 1,800 | 900 | 540 | 531 | |
V24C3V3M75BL Micro Module |
25°C | 6,235 | 3,117 | 1,870 | 1,839 |
50°C | 3,803 | 1,902 | 1,141 | 1,122 | |
65°C | 2,930 | 1,465 | 879 | 864 | |
V24B5M200BL Mini Module |
25°C | 4,205 | 2,102 | 1,201 | 1,240 |
50°C | 2,565 | 1,282 | 769 | 757 | |
65°C | 1,976 | 988 | 593 | 583 | |
V24A12M400BL Maxi Module |
25°C | 3,428 | 1,714 | 1,028 | 845 |
50°C | 2,091 | 1,282 | 627 | 617 | |
65°C | 1,611 | 806 | 483 | 475 |
Environmental Qualification
Fully encapsulated, Vicor Maxi, Mini, Micro, and MI family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the harshest environments. In addition to providing mechanical rigidity, the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Modules are available with temperatures down to -55°C operating and -65°C storage.
To verify the suitability of Vicor's H & M-Grade Maxi, Mini, and Micro as well as MI Family modules for harsh environments, these products have been subjected to the environmental testing requirements of MIL-STD-810, and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request.
Altitude
- MIL-STD-810F
Method 500.4
Procedure I & II
40,000 ft.and 70,000 ft. Operational
- MIL-STD-810D
Method 500.2
Procedure III
explosive decompression (40 K ft.) - MIL-STD-810D
Method 500.2
Procedure II
40,000 ft.
1000 – 1500 ft./min. to
70,000 ft., unit functioning
Explosive Atmosphere
- MIL-STD-810F
Method 511.4
Procedure I
Operational
- MIL-STD-810C
Method 511.1
Procedure I
Vibration
- MIL-STD-810F
Method 514.5
Procedure I
category 14
sine and random vibration
per Table 514.5C
for helicopter AH-6J main rotor
with overall level of 5.6 g rms
for 4 hours per axis - MIL-STD-810F
Method 514.5C
general minimum
integrity curve
per Figure 514.5C-17
with overall level of 7.7 g rms
for 1 hr per axis
- MIL-STD-810D
Method 514.3
Procedure I
category 6
helicopter, 20 g - MIL-STD-810D
Method 514.3
random:
10 – 300 Hz @ 0.02 g2/Hz
2000 Hz @ 0.002 g2/Hz
3.9 total g rms
3 hrs/axis
sine:
30 Hz @ 20 g
60 Hz @ 10 g
90 Hz @ 6.6 g
120 Hz @ 5.0 g
16.0 total g rms
3 axes - MIL-STD-810E
Method 514.4
Table 514.4-VII
±6 db/octave 7.7 g rms
1hr/axis
Shock
- MIL-STD-810F
Method 516.5
Procedure I
functional shock, 40 g - MIL-STD-202F
Method 213B
60 g, 9 ms half sine - MIL-STD-202F
Method 213B
75 g, 11 ms saw tooth shock
- MIL-STD-810D
Method 516.3
Procedure I
functional shock, 40 g - MIL-STD-202F
Method 213B
18 pulses, 60 g, 9 msec - MIL-STD-202F
Method 213B
75 g, 11 ms saw tooth shock - MIL-STD-202F
Method 207A
3 impacts / axis, 1, 3, 5 feet
Acceleration
- MIL-STD-810F
Method 513.5
Procedure II
Table 513.5-II
Operational
2 – 7 g
6 directions
- MIL-STD-810D
Method 513.3
Procedure II
Operational test
9 g for 1 minute
along 3 mutually
perpendicular axes
Humidity
- MIL-STD-810F
Method 507.4
95% Relative Humidity
- MIL-STD-810F
Method 507.4
95% Relative Humidity
Solder Test
- MIL-STD-202G
Method 208H
8 hr aging
- MIL-STD-202G
Method 208H
8 hr aging
Fungus
- MIL-STD-810F
Method 508.5
- MIL-STD-810C
Method 508.1
Salt Fog
- MIL-STD-810F
Method 509.4
- MIL-STD-810C
Method 509.1