The future of standardized defense platforms using MOSA, SOSA and VPX open architectures
The future of standardized defense platforms using MOSA, SOSA and VPX open architectures
MIL-COTS MicroRAM™ Output Ripple Attenuator Module
The MicroRAM output ripple attenuation module combines both active and passive filtering to achieve greater than 40dB of noise attenuation from 60Hz to 1MHz. The MicroRAM operates over a range of 3 – 30VDC, is available in either 20 or 30A models and is compatible with most manufacturers switching converters including Vicor's MI-200/MI-J00 and Maxi, Mini and Micro series DC-DC converters.
The MicroRAM's closed-loop architecture greatly improves load transient response and with dual mode control, insures precise point-of-load voltage regulation. The MicroRAM supports redundant and parallel operation with its integrated ORing diode function.
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
>40dB ripple attenuation from 60Hz to 1MHz
Environmental stress screening
Combined active and passive filtering
20 and 30 Ampere ratings
Resources
Resources for the design engineer
Delivering higher power density and low noise for New Space applications
Patented power design techniques and architectures needed to deliver optimal power and low noise for space communications applications
Spaceships high current transponder powers on-orbit AI-driven communication
Smaller satellites with sophisticated computational capabilities is in demand. Learn how low-noise, AI-enabled power is driving creative new applications
Current multipliers: The obvious choice for powering AI processors and other demanding applications
AI processors need to handle low-voltage, high-current demand, which can cause power system bottlenecks. Learn how current multiplication can change that
- Maxi, Mini, Micro Design Guide and Applications Manual
- 1. High Density DC-DC Converter Technology
- 2. Control Pin Functions and Applications
- 3. Design Requirements
- 4. EMC Considerations
- 5. Current Sharing in Power Arrays
- 6. Thermal Performance Information
- 7. Autoranging Rectifier Module (ARM)
- 8. Filter / Autoranging Rectifier Module (FARM)
- 9. Modular AC Front-end System (ENMod)
- 10. High Boost HAM
- 11. Filter Input Attenuator Module (FIAM)
- 12. Output Ripple Attenuator Module (MicroRAM)
- 13. Lead Free Pins (RoHS)
- 14. Tin Lead Pins
- 15. Surface Mount Socketing System (SurfMate)
- 16. Through-hole Socket-mount System (InMate)
- 17. Glossary of Technical Terms
For California residents see information regarding California Proposition 65
- Micro, short tin / lead pin, slotted baseplate
STEP 3D PDF - Micro, short tin / lead pin, threaded baseplate
STEP 3D PDF - Micro, short tin / lead pin, through-hole baseplate
STEP 3D PDF - Micro, long tin / lead pin, slotted baseplate
STEP 3D PDF - Micro, long tin / lead pin, threaded baseplate
STEP 3D PDF - Micro, long tin / lead pin, through-hole baseplate
STEP 3D PDF - Micro, short ModuMate, slotted baseplate
STEP 3D PDF - Micro, short ModuMate, threaded baseplate
STEP 3D PDF - Micro, short ModuMate, through-hole baseplate
STEP 3D PDF - Micro, long ModuMate, slotted baseplate
STEP 3D PDF - Micro, long ModuMate, threaded baseplate
STEP 3D PDF - Micro, long ModuMate, through-hole baseplate
STEP 3D PDF - Micro, short gold pin (RoHS), slotted baseplate
STEP 3D PDF - Micro, short gold pin (RoHS), threaded baseplate
STEP 3D PDF - Micro, short gold pin (RoHS), through-hole baseplate
STEP 3D PDF - Micro, long gold pin (RoHS), slotted baseplate
STEP 3D PDF - Micro, long gold pin (RoHS), threaded baseplate
STEP 3D PDF - Micro, long gold pin (RoHS), through-hole baseplate
STEP 3D PDF
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